VIAVI MAP Series mVOA-C2B high-density variable optical attenuator module
VIAVI / mVOA-C2B / Variable Optical Attenuators
MVOA-C2B12-SB1-M100-MLC

MAP Series mVOA-C2B MVOA-C2B12-SB1-M100-MLC 12-Channel Variable Optical Attenuator with In/Out Power Monitors, LC/PC

MAP Series MEMS-based variable optical attenuator module with 12 devices, in/out power monitors and singlemode LC/PC connectors.

Configuration
Input and Output Monitor
Number of Channels
12 devices
Connector
SMF LC/PC
Datasheet

Overview

The MVOA-C2B12-SB1-M100-MLC is a configuration of the VIAVI MAP Series High Density Variable Optical Attenuator (mVOA-C2B). It has 12 independently controlled MEMS-based attenuator devices in one module. Each device has input and output power monitors, and the module uses singlemode LC/PC connectors.

The mVOA-C2B builds on the earlier mVOA-C1. It is based on a MEMS mirror design and provides low insertion loss, return loss and polarization dependent loss, with high repeatability, accuracy and long-term stability. It covers the 1260 to 1640 nm wavelength range. Typical uses include client optic testing, next-generation coherent interfaces, long-haul network stress testing and silicon photonics development.

Operating modes

The in/out monitor variant supports three control modes. In Attenuator Mode, the user sets the output attenuation directly from the user interface or by remote SCPI command. In Constant Power Mode, the monitors actively control the attenuator to hold a set output power while the input power changes. In IL Mode, a VIAVI calibration lets the user set the insertion loss from the input port to the output port, so the absolute loss is known rather than only the relative attenuation.

Platform

The module is a single-slot, hot-pluggable cassette for MAP-300 generation mainframes. Up to eight modules fit in one 3U MAP-300 mainframe, for up to 96 independently controlled attenuators. This density suits network emulation test systems in lab and production environments.

Key Features

  • 12 independently controlled MEMS-based attenuator devices in one module
  • Integrated input and output power monitors per device
  • Attenuator, Constant Power and IL control modes
  • Remote control via SCPI commands
  • Up to 96 attenuators in a single 3U MAP-300 chassis
  • Low insertion loss to minimize loss budget utilization
  • High accuracy and repeatability to reduce measurement uncertainty
  • Fast transition speed and settling time to reduce testing time
  • Flat spectral response to reduce wavelength-dependent uncertainty in CWDM and DWDM applications
  • Low backreflection to reduce instabilities due to reflected light
  • Built-in wavelength-calibrated power meter, which removes external connections
  • High input power capability for EDFA testing and multi-wavelength applications
  • Single-slot, hot-pluggable module for MAP-300 generation mainframes
  • Singlemode LC/PC connectors

Specifications

Configuration
Configuration Input and Output Monitor
Number of Channels 12 devices
Series available with 4, 8 or 12 devices
Connector SMF LC/PC
Series available with LC/PC and LC/APC
Optical
Wavelength Range 1260 to 1640 nm
Measured after minimum 30-minute warm up at constant temperature of 23 ±5°C
Insertion Loss <=2.2 dB
Input and Output Monitor configuration
Attenuation Range > 40 dB
Return Loss 40 dB min/55 dB typ
Shutter Isolation > 45 dB
Maximum Optical Input Power 23 dBm
Input and Output Monitor configuration
Optical – Power Mode (Output Monitor Control)
Power Setting Range -40 dBm to 23 dBm
Power Setting Resolution 0.001 dB
Repeatability ±0.10 dB
Power Linearity ±0.02 dB
PDL <0.1 dB
Optical – IL Mode (Input/Output Closed Loop Control)
Input Power Range for Full Attenuation -40 dBm to 23 dBm
Attenuation Setting Range 0 dB to 40 dB
Repeatability ±0.10 dB
Relative Attenuation Accuracy ±0.10 dB
PDL <0.1 dB
Speed and Timing
Settling Time <500 microsec
Input and Output Monitor configuration
Attenuation Speed 0.1 dB/s to 1000 dB/s
MAP Command Latency < 1 ms
Activation Latency < 500 μs
Trigger Latency < 10 μs
Physical
Warm-up Time 30 min
Slot Width 1 standard module
Calibration Period 1 Year
Operating Temperature 10 °C to 40 °C
Requirement
Storage Temperature -30°C to 60°C

Specifications are taken from the manufacturer's documentation. See the datasheet for complete and current values.

Applications

  • Network emulation test systems
  • Client optic testing
  • Next-generation coherent interface testing
  • Long-haul network stress testing
  • Silicon photonics development
  • EDFA testing
  • CWDM and DWDM testing
  • Lab and production test

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