VIAVI MAP Series mVOA-C2B high-density variable optical attenuator module
VIAVI / mVOA-C2B / MAP Modules
MVOA-C2B08-SB0-M100-MLC

VIAVI MAP Series mVOA-C2B MVOA-C2B08-SB0-M100-MLC 8-Channel Variable Optical Attenuator Module, LC/PC

MEMS-based 8-device variable optical attenuator module for the MAP-300 platform, no power monitors, singlemode LC/PC connectors.

Configuration
No Monitor
Number of Channels
8
Connector
LC/PC
Datasheet

Overview

The MVOA-C2B08-SB0-M100-MLC is the 8-device, no-monitor, LC/PC version of the VIAVI MAP Series mVOA-C2B high-density variable optical attenuator. The ordering information describes it as MAP Series VOA B-type 8 devices no option SMF LC/PC. The module uses a MEMS mirror design and is built for programmable attenuation in lab and production test.

The mVOA-C2B is a hot-pluggable, single-slot cassette for the VIAVI MAP ecosystem and works with all MAP-300 generation mainframes. Up to eight modules fit in one 3U MAP-300 mainframe, so a fully loaded chassis can hold up to 96 independently controlled attenuators when 12-device modules are used. It follows the earlier mVOA-C1 attenuator.

Operating mode

This no-monitor variant runs in Attenuator Mode. The user enters the desired attenuation through the user interface or a remote SCPI command, and the module sets the output attenuation directly in open loop. Constant Power Mode and IL Mode need the in/out monitor variants (SB1).

Applications

The datasheet lists client optic testing, next-generation coherent interfaces, long-haul network stress testing and silicon photonics development as uses. The wide wavelength range covers CWDM and DWDM work, and the high input power capability suits EDFA and multi-wavelength testing.

Key Features

  • MEMS mirror-based programmable optical attenuation
  • 8 independently controlled attenuator devices in one module
  • Singlemode fiber LC/PC connectors
  • Single-slot, hot-pluggable module for all MAP-300 generation mainframes
  • Up to 96 attenuators in a single 3U MAP-300 mainframe
  • Low insertion loss, return loss and polarization dependent loss
  • High accuracy and repeatability
  • Fast transition speed and settling time
  • Flat spectral response for CWDM and DWDM applications
  • Low backreflection
  • High input power capability for EDFA testing and multi-wavelength applications
  • Attenuation control from the UI or remote SCPI commands

Specifications

Configuration
Configuration No Monitor
Number of Channels 8
Series available with 4, 8, 12
Connector LC/PC
SMF; series available with LC/PC and LC/APC
Optical
Wavelength Range 1260 to 1640 nm
All optical measurements taken after minimum 30-minute warm up; measured at constant temperature of 23 ±5°C
Insertion Loss <=1.6 dB
No Monitor configuration
Attenuation Range > 40 dB
Return Loss 40 dB min/55 dB typ
Shutter Isolation > 45 dB
Maximum Optical Input Power 27 dBm
No Monitor configuration
Optical – Attenuation Mode (Open Loop or No Power Monitor)
Repeatability ±0.05 dB (typ.), 0 dB to 30 dB; ±0.10 dB (typ.), 30 dB to 40 dB
Relative Attenuation Accuracy ±0.15 dB (typ.), 0 dB to 10 dB; ±0.15 dB (typ.), 10 dB to 20 dB; ±0.20 dB (typ.), 10 dB to 20 dB
As printed in the datasheet; the 10 dB to 20 dB range appears twice with different values
PDL < 0.15 dB, at 0 dB; < 0.30 dB, 0 dB to 10 dB; < 0.50 dB, 10 dB to 20 dB
Speed and Timing
Attenuation Speed 0.1 dB/s to 1000 dB/s
MAP Command Latency < 1 ms
Activation Latency < 500 μs
Trigger Latency < 10 μs
Physical
Warm-up Time 30 min
Slot Width 1 standard module
Calibration Period 1 Year
Operating Temperature 10 °C to 40 °C
Requirement
Storage Temperature -30°C to 60°C
Compatible Mainframes All MAP-300 generation mainframes
Up to eight modules in a single MAP-300 mainframe

Specifications are taken from the manufacturer's documentation. See the datasheet for complete and current values.

Applications

  • Network emulation test systems
  • Client optic testing
  • Next generation coherent interfaces
  • Long haul network stress testing
  • Silicon photonics development
  • EDFA testing
  • CWDM and DWDM applications
  • Lab and production test

Options & Accessories

Option Description
CleanBlastPRO CleanBlastPRO fiber end-face cleaning system — Optional inspection and cleaning tool for removing dirt and debris from connectors.
FiberChek FiberChek probe microscope — Optional one-button handheld fiber inspection probe.

Documents & Resources